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HO fine powder
Our "HO" series (High Performance Optical Emery) is a premier alumina-based fine powder, uniquely engineered to outperform standard synthetic abrasives in precision lapping.
At the heart of the electronics industry, semiconductor wafers and compound semiconductors require flawless surfaces. The HO series is specifically designed for these demanding materials, ensuring an exceptionally even and flat finish. By utilizing carefully selected raw materials with a unique crystal structure and optimized hardness, HO achieves superior self-sharpening properties.
This advanced composition not only provides consistent, stable grinding but also significantly reduces surface scratches. Beyond semiconductors, HO delivers peak performance for lenses, prisms, quartz, and various glass materials, meeting the highest standards of optical and electronic manufacturing.

| Type | Particle Size | Specific gravity |
Chemical composition (%) | ||||
| Al2O3 | SiO2 | Fe2O3 | TiO2 | ZrO2 | |||
| HO | #320 ~ #1200 | 3.75 min. | 53.0 min. | 25.0 max. | 1.0 max. | 4.0 max. | 30.0 max. |
| #1500 ~ #4000 | 3.65 min. | 48.0 min. | 30.0 max. | 1.2 max. | 4.0 max. | 30.0 max. | |